Honeywell turns down the heat with phone cooling solution

Honeywell has unveiled a cooling solution to assist smartphone manufacturers and designers manage heat dissipation in phones.

The Thermal Interface Materials (TIM) solution is based on phase change materials (PCMs), which allows the technology to transfer thermal energy from phone chips to a heat sink or spreader, where it is then dissipated into the surround environment.

The solution keeps chips cool enabling the phone to perform reliably even during the most data intense processes and during heat spikes.

Olivier Biebuyck, vice president and general manager of Honeywell Electronic Materials, said: "Honeywell's innovative TIM technology provides customers with the ideal solution to optimize their phones' performances.

"The Middle East region has some of the highest smartphone penetration rates in the world, particularly in the UAE and KSA. As demand for smartphones grows around the region and globally, these breakthrough designs help provide optimal user experience throughout the entire lifecycle of their devices. Middle East smartphone users could increasingly see Honeywell materials protect their phones from overheating and ensure more reliable performance," he added.

TIM products are designed to optimise thermal impedance across the entire thermal path, providing an end-to-end solution for thermal performance. The PCM design can be customised to fit diverse product applications and end uses, providing customers with precisely what they need, when they need it.